GOMEZ, A.G.RECCO, A.A.C.LIMA, N.B.MARTINEZ, L.G.TSCHIPTSCHIN, A.P.SOUZA, R.M.2014-07-152014-07-302014-07-152014-07-302010GOMEZ, A.G.; RECCO, A.A.C.; LIMA, N.B.; MARTINEZ, L.G.; TSCHIPTSCHIN, A.P.; SOUZA, R.M. Residual stresses in titanium nitride thin films obtained with step variation of substrate bias voltage during deposition. <b>Surface and Coatings Technology</b>, v. 204, n. 20, p. 3228-3233, 2010. DisponÃvel em: http://repositorio.ipen.br/handle/123456789/4707.0257-8972http://repositorio.ipen.br/handle/123456789/47073228-3233openAccesstitanium nitridesthin filmsresidual stressessputteringx-ray diffractionResidual stresses in titanium nitride thin films obtained with step variation of substrate bias voltage during depositionArtigo de periódico20204https://orcid.org/0000-0001-7707-7821https://orcid.org/0000-0002-6444-9224