FONSECA, DANIELA P.MONTEIRO, WALDEMAR A.2020-02-282020-02-282019FONSECA, DANIELA P.; MONTEIRO, WALDEMAR A. The microstructure and properties of copper with ceria nanoparticles addition. <b>Journal of Materials Science and Chemical Engineering</b>, v. 7, n. 10, p. 40-48, 2019. DOI: <a href="https://dx.doi.org/10.4236/msce.2019.710004">10.4236/msce.2019.710004</a>. Disponível em: http://repositorio.ipen.br/handle/123456789/30841.2327-6045http://repositorio.ipen.br/handle/123456789/30841Copper-based composites strengthened by ceria nanoparticles were processed by conventional powder metallurgy: mixing (30 min and 46 rpm), compaction (cold, uniaxial, 1080 MPa for 10 s) and sintering (800˚C for 6 h in vacuum atmosphere of 10−5 torr). It was studied the microstructure (optical microscopy, scanning electron microscopy), X-ray diffraction with Rietveld refinement and some properties (electrical conductivity, Vickers hardness and fracture analysis) of the compositions 92 wt% Cu - 8 wt% CeO2 and 80 wt% Cu - 20 wt% CeO2. The results showed uniform phase distribution, low porosity and ceria disperse inside copper grain. In despite of properties, the composites had electrical conductivity of 38% IACS and 15% IACS and hardness of 69 and 88 HV5, respectively. The results of 92 wt% Cu - 8 wt% CeO2 composites were promising, and they are in according with actual literature.40-48openAccesscoppermicrostructurenanoparticlesceriumelectric conductivityhardnessadditivescomposite materialspowdersArtigo de periódico10710.4236/msce.2019.7100040000-0003-1153-6460Sem PercentilSem Percentil CiteScore