The microstructure and properties of copper with ceria nanoparticles addition

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dc.contributor.authorFONSECA, DANIELA P.pt_BR
dc.contributor.authorMONTEIRO, WALDEMAR A.pt_BR
dc.coverageInternacionalpt_BR
dc.date.accessioned2020-02-28T17:22:38Z
dc.date.available2020-02-28T17:22:38Z
dc.date.issued2019pt_BR
dc.description.abstractCopper-based composites strengthened by ceria nanoparticles were processed by conventional powder metallurgy: mixing (30 min and 46 rpm), compaction (cold, uniaxial, 1080 MPa for 10 s) and sintering (800˚C for 6 h in vacuum atmosphere of 10−5 torr). It was studied the microstructure (optical microscopy, scanning electron microscopy), X-ray diffraction with Rietveld refinement and some properties (electrical conductivity, Vickers hardness and fracture analysis) of the compositions 92 wt% Cu - 8 wt% CeO2 and 80 wt% Cu - 20 wt% CeO2. The results showed uniform phase distribution, low porosity and ceria disperse inside copper grain. In despite of properties, the composites had electrical conductivity of 38% IACS and 15% IACS and hardness of 69 and 88 HV5, respectively. The results of 92 wt% Cu - 8 wt% CeO2 composites were promising, and they are in according with actual literature.pt_BR
dc.format.extent40-48pt_BR
dc.identifier.citationFONSECA, DANIELA P.; MONTEIRO, WALDEMAR A. The microstructure and properties of copper with ceria nanoparticles addition. <b>Journal of Materials Science and Chemical Engineering</b>, v. 7, n. 10, p. 40-48, 2019. DOI: <a href="https://dx.doi.org/10.4236/msce.2019.710004">10.4236/msce.2019.710004</a>. Disponível em: http://repositorio.ipen.br/handle/123456789/30841.
dc.identifier.doi10.4236/msce.2019.710004pt_BR
dc.identifier.fasciculo10pt_BR
dc.identifier.issn2327-6045pt_BR
dc.identifier.orcid0000-0003-1153-6460pt_BR
dc.identifier.percentilfiSem Percentilpt_BR
dc.identifier.percentilfiCiteScoreSem Percentil CiteScore
dc.identifier.urihttp://repositorio.ipen.br/handle/123456789/30841
dc.identifier.vol7pt_BR
dc.relation.ispartofJournal of Materials Science and Chemical Engineeringpt_BR
dc.rightsopenAccesspt_BR
dc.subjectcopper
dc.subjectmicrostructure
dc.subjectnanoparticles
dc.subjectcerium
dc.subjectelectric conductivity
dc.subjecthardness
dc.subjectadditives
dc.subjectcomposite materials
dc.subjectpowders
dc.titleThe microstructure and properties of copper with ceria nanoparticles additionpt_BR
dc.typeArtigo de periódicopt_BR
dspace.entity.typePublication
ipen.autorWALDEMAR ALFREDO MONTEIRO
ipen.autorDANIELA PASSARELO MOURA
ipen.codigoautor982
ipen.codigoautor14361
ipen.contributor.ipenauthorWALDEMAR ALFREDO MONTEIRO
ipen.contributor.ipenauthorDANIELA PASSARELO MOURA
ipen.date.recebimento20-02
ipen.identifier.fiSem F.I.pt_BR
ipen.identifier.fiCiteScoreSem CiteScore
ipen.identifier.ipendoc26671pt_BR
ipen.type.genreArtigo
relation.isAuthorOfPublication5a26fe3e-3f2b-415a-a692-8d1075ce58ed
relation.isAuthorOfPublicationc60c8d20-bf3b-4875-b8f6-dab0524cea70
relation.isAuthorOfPublication.latestForDiscoveryc60c8d20-bf3b-4875-b8f6-dab0524cea70
sigepi.autor.atividadeMONTEIRO, WALDEMAR A.:982:730:Npt_BR
sigepi.autor.atividadeFONSECA, DANIELA P.:14361:730:Spt_BR
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