The microstructure and properties of copper with ceria nanoparticles addition
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2019
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Journal of Materials Science and Chemical Engineering
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Resumo
Copper-based composites strengthened by ceria nanoparticles were processed
by conventional powder metallurgy: mixing (30 min and 46 rpm), compaction
(cold, uniaxial, 1080 MPa for 10 s) and sintering (800˚C for 6 h in vacuum
atmosphere of 10−5 torr). It was studied the microstructure (optical microscopy,
scanning electron microscopy), X-ray diffraction with Rietveld refinement
and some properties (electrical conductivity, Vickers hardness and
fracture analysis) of the compositions 92 wt% Cu - 8 wt% CeO2 and 80 wt%
Cu - 20 wt% CeO2. The results showed uniform phase distribution, low porosity
and ceria disperse inside copper grain. In despite of properties, the
composites had electrical conductivity of 38% IACS and 15% IACS and hardness
of 69 and 88 HV5, respectively. The results of 92 wt% Cu - 8 wt% CeO2
composites were promising, and they are in according with actual literature.
Como referenciar
FONSECA, DANIELA P.; MONTEIRO, WALDEMAR A. The microstructure and properties of copper with ceria nanoparticles addition. Journal of Materials Science and Chemical Engineering, v. 7, n. 10, p. 40-48, 2019. DOI: 10.4236/msce.2019.710004. Disponível em: http://repositorio.ipen.br/handle/123456789/30841. Acesso em: 23 Mar 2025.
Esta referência é gerada automaticamente de acordo com as normas do estilo IPEN/SP (ABNT NBR 6023) e recomenda-se uma verificação final e ajustes caso necessário.