Soldering mask laser removal from printed circuit boards aiming copper recycling
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Waste Management
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Management of waste of electric and electronic equipment (WEEE) is a key issue for modern societies;
furthermore, it contains valuable materials that can be recycled, especially in printed circuit boards
(PCB), which have approximately one-third of their weight in copper. In this study we demonstrated
the use of laser to strip the covering soldering mask on PCB’s, thus exposing the copper underneath so
that extraction techniques may take place. Using a Q-Switched Nd:YAG laser operating at 1064 nm
and 532 nm we tested the procedure under different energy conditions. The laser stripping of the soldering
mask was achieved with satisfactory results by irradiation with 225 mJ at 1064 nm. However, when
using similar parameters at 532 nm the process of the coating ejection was not promoted properly, leading
to a faulty detachment. Infrared laser PCB stripping presents itself to be technically viable and environmental
friendly, since it uses no chemicals inputs, offering one more option to WEEE treatment and
recycling.
Como referenciar
RAELE, MARCUS P.; PRETTO, LUCAS R. de; ZEZELL, DENISE M. Soldering mask laser removal from printed circuit boards aiming copper recycling. Waste Management, v. 68, p. 475-481, 2017. DOI: 10.1016/j.wasman.2017.07.019. Disponível em: http://repositorio.ipen.br/handle/123456789/27799. Acesso em: 30 Dec 2025.
Esta referência é gerada automaticamente de acordo com as normas do estilo IPEN/SP (ABNT NBR 6023) e recomenda-se uma verificação final e ajustes caso necessário.