Anodic film formation on aluminium alloys
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Materials Chemistry and Physics
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In the present study, anodic film formation on high-strength aluminium alloys (AA2024-T3, AA2198-T8, AA2198-T851 and AA7475-T761) in tartaric–sulfuric acid (TSA) is investigated, with focus on defects induced by the dissolution of constituent intermetallic particles (IMPs) during anodizing. High-copper-containing IMPs dissolve rapidly, generating micrometer-sized cavities in resultant anodic films. In contrast, Fe–Mn–Si (Cu) IMPs in AA2024-T3 and low-copper-containing IMPs in AA7475-T761 exhibit slower dissolution rate than high-copper-containing ones, resulting in locally modified porous morphology and non-uniform film thickness. Further, it is observed that the morphological and compositional uniformity of resultant anodic films are largely affected by the size, location and composition of IMPs.
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ARAUJO, JOAO V. de S.; CHEN, JINGHU; COSTA, ISOLDA; ZHOU, XIARONG. Anodic film formation on aluminium alloys: analysis of defects induced by constituent intermetallic particles. Materials Chemistry and Physics, v. 350, p. 1-15, 2025. DOI: 10.1016/j.matchemphys.2025.131803. Disponível em: https://repositorio.ipen.br/handle/123456789/49736. Acesso em: 29 Apr 2026.
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