In-operando 3D visualization of nickel electrodeposition and mass transport phenomena

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International Journal of Electrochemical Science
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Nickel electrodeposition is widely used in industrial applications due to its ability to enhance the mechanical and corrosion resistance of metallic substrates. However, understanding mass transport mechanisms during electrodeposition remains a challenge, as conventional models struggle to describe complex three-dimensional phenomena such as concentration gradients, depletion zones, and convective instabilities. In this study, we employ X-ray micro-computed tomography (X-ray μCT) in-operando imaging technique to investigate the electrodeposition of nickel on titanium under potentiostatic conditions. Chronoamperometric analysis and scanning electron microscopy (SEM) confirmed distinct deposition behaviors at 􀀀 0.5 V and 􀀀 1.2 V, with negligible deposition at the lower potential and significant nickel growth, including dendritic structures, at the higher potential. The X-ray μCT images revealed the formation of structured ionic layers near the electrode surfaces, with Ni²⁺ ion migration and concentration gradients influencing deposition dynamics. At 􀀀 1.2 V, depletion zones and convective instabilities were identified, suggesting a competition between diffusion, migration, and Rayleigh- B´enard convection. These findings demonstrate the feasibility of X-ray μCT for real-time 3D visualization of electrochemical processes, providing novel insights into mass transport during electrodeposition.

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SOUZA, RODRIGO F.B. de; DEL POZZO, ANDREA S.; GIULIANO, ANTONIO D.; SILVESTRIN, GABRIEL; DE MICHELI, LORENZO; SOARES, EDSON P.; GIOVEDI, CLAUDIA; TERREMOTO, LUIS A.A.; SOMESSARI, SAMIR L.; O. NETO, ALMIR; CALVO, WILSON. In-operando 3D visualization of nickel electrodeposition and mass transport phenomena: insights from X-ray microcomputed tomography. International Journal of Electrochemical Science, v. 20, n. 8, p. 1-4, 2025. DOI: 10.1016/j.ijoes.2025.101090. Disponível em: https://repositorio.ipen.br/handle/123456789/49339. Acesso em: 20 Mar 2026.
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