Residual stresses in titanium nitride thin films obtained with step variation of substrate bias voltage during deposition

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2010
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Surface and Coatings Technology
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GOMEZ, A.G.; RECCO, A.A.C.; LIMA, N.B.; MARTINEZ, L.G.; TSCHIPTSCHIN, A.P.; SOUZA, R.M. Residual stresses in titanium nitride thin films obtained with step variation of substrate bias voltage during deposition. Surface and Coatings Technology, v. 204, n. 20, p. 3228-3233, 2010. Disponível em: http://repositorio.ipen.br/handle/123456789/4707. Acesso em: 17 Mar 2025.
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titanium nitrides; thin films; residual stresses; sputtering; x-ray diffraction
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http://repositorio.ipen.br/handle/123456789/4707
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